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TE Connectivity 1734328-1

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TE Connectivity 1734328-1

Delivery Time : 1 working day

Brand Name : 1734328-1

Model Number : 1734328-1

MOQ : 1

Stock : 7

Packaging Details : -

Description : USB, DVI, HDMI Connector Assemblies RoHS

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Product Overview

This specification covers performance, tests, and quality requirements for the MINI USB CONNECTOR SERIES. Designed for reliable electrical, mechanical, and environmental performance.

Product Attributes

  • Brand: Tyco Electronics
  • Origin: Taipei, Taiwan
  • Housing Material: Thermoplastic, UL94V-0
  • Contact Material: Copper Alloy, Gold plating on contact area, Tin-lead or Tin plated on soldertails, Nickel underplated all over
  • Front Shell Material: Copper Alloy, Nickel plated over Cu underplated all over
  • Rear Shell Material: Steel, Tin plated over Nickel underplated all over

Technical Specifications

SpecificationDetailsReference
Current Rating1.0 Ampere
Voltage Rating30 VAC RMS Max.
Operating Temperature-40C to +85C
Low Level Contact ResistanceInitial: 50 m Max.
After test: 50 m Max.
EIA 364-23
Insulation ResistanceInitial: 100 M Min.
After test: 100 M Min.
EIA 364-21
Dielectric Withstanding Voltage100 V AC for one minute at sea level (No flashover or insulation breakdown, Leakage current: 0.5mA Max.)EIA 364-20
Contact Capacitance2 pF Maximum per ContactEIA 364-30
Contact Current Rating1.0A at 250Vac Min. (T shall not exceed +30C)EIA 364-70 Method B
Random VibrationNo discontinuity at 1sec or longer (5.35 Gs rms)EIA 364-28 Test Condition V Test Letter A
Physical ShockNo discontinuity at 1sec or longer (30Gs half-sine shock pulses of 11ms duration)EIA 364-27 Test Condition H
DurabilityNo discontinuity at 1sec or longer (5000 cycles)EIA 364-09
Connector Mating Force3.57Kgf (35 Newtons) Max.EIA 364-13
Connector Unmating ForceInitial: 0.71Kgf (7 Newtons) Min.
After test: 0.31Kgf (3 Newtons) Min.
EIA 364-13
Cable Pull-out ForceCable shall be not dislodge from cable (40 Newtons axial load for 1 minute)EIA 364-38
Thermal ShockShall meet visual requirement, show no physical damage.EIA 364-32, Test Condition I
Humidity TestShall meet visual requirement, show no physical damage.EIA 364-31, Test Condition A Method III
Temperature LifeShall meet visual requirement, show no physical damage.EIA 364-17 Test Condition 3 Method A
SolderabilityThe inspected area of each lead must have 95% solder coverage minimum.
Steam Aging Preconditioning(1) TinTin-Cu Coating: 93+3/-5100%RH8hrs.
(2) Other Coating: 93+3/-5100%RH1hrs.
J-STD-002 category 3/2 aging
Resistance to Wave Soldering HeatNo physical damage shall occur. (Solder Temp.: 240+/-5, 10+2/-0sec. for PBT; 265+/-5, 10+2/-0sec. for PA9T)
Resistance to Reflow Soldering HeatNo physical damage shall occur. (Peak Temp.: 260+0/-5, 20~40sec. Duration: 3 cycles)Tyco spec. 109-201, Condition B


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